Chemical Mechanical Polisher
TMP-200S/300S
This series is CMP polishing equipment suitable for thin film (dielectric layer), including the planarization polishing of oxides, metals, STI, SOI, MEMS, and other products. The air bag film is used for flexible pressurization to realize nanoscale precision removal. These machines are equipped with the semi-automatic chip loading and unloading system. The EPD functions such as friction, eddy current, and online infrared detection are optional.
Wafer Size6/8 inch
Wafer Airbag Pressure70-700 g/cm2
Diameter of PlatesOD530 mm
