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History
2024
B+ Round of Financing & In-depth Development
  • Won the title of“national specialized,unique and new small giant enterprise”&“Chinese (potential) unicorn enterprise”&“2024 Hurun Global Cheetah Enterprise”
  • Successfully launched 8” silicon carbide substrate grinding and polishing full-line equipment and 8” silicon carbide wafer grinder
  • Established the Langfang Branch
  • Completed B+ round of financing
2023
Series B Financing & Establishment of branch office
  • Won the Beijing special new small and medium-sized enterprise, Beijing intellectual property pilot unit,
  • Post-doctoral research workstation identification
  • Successfully released TFG series automatic grinder, TPC series automatic chemical mechanical polisher,
  • TSC series wafer scrubber and TGP series diamond polisher
  • Set up branchs in Wuxi, Shenzhen
  • Completed Series B financing
2022
Strategic financing & moving the Company to a new location
  • Strategic investment reached with Shenzhen Hubble and the first round of investment with Anxin and Hongtai
  • Successfully launched TDL and TDP series double-sided grinding and polishing equipment
  • Able to provide silicon carbide substrate grinding and polishing line equipment
  • Established the Langtour Laboratory and Excelsior Laboratory
  • Moved the Company to Scientific Entrepreneurship Chip Park No.1
2021
Increase R&D investment & develop the business rapidly
  • Awarded as a national high-tech enterprise
  • Successfully launched TAP series single-sided polishing equipment to enrich the product line
  • Able to meet diversified market demands
2020
Accelerate equipment R&D & expand the business comprehensively
  • Established the TSD Semiconductor Company with a focus on the semiconductor industry
  • Successfully launched TSP series single-sided polishing machine
  • IVG series grinder
2014-2020
Accumulate technology & build a product system
  • Independent research and development have been built up over 6 years,Established the three major product systems of thinning, polishing, and CMP
Brand Culture