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Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder
Wafer Scrubber
Chemical Mechanical Polishing for Glass Substrate
TPP-1310
An operator manually places the carrier plate onto the loading/unloading workstation. The workstation then transfers the plate onto the upper polishing platen for automated polishing. The machine is equipped with friction-based endpoint detection, which automatically stops the process once the target value is reached.
  • Wafer Size

    515*510mm / 600*600mm

  • Number of Polishing Platens

    1

  • Diameter of the upper spindle polishing platen

    OD930 mm

  • Adsorption Method

    Wax-Free Pad Adsorption

    • Features
    Endpoint Detection
    Equipped with advanced high-precision EPD (Endpoint Detection) monitoring function
    Zonal Pressure Control
    Optimize pressure distribution to ensure polishing uniformity
    High Compatibility
    The equipment is compatible with substrates of different sizes
    Semi-Automatic Loading/Unloading
    Unique Light-Touch Loading/Unloading System to Avoid Damage
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